【Introduction】
Due to the advantages of energy saving, best brightness and higher power, LED has been applied in many fields as general illumination backlight for LCD, and automotive light. In encapsulation epoxy resin can not stand heat cycle on applications，RAY-8626 is high heat resistant additional type silicone rubber.
Our Silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stand higher temperature, moisture proof and adhesive for better weather resistance.
Our Silicone series is suitable for temperature -50℃ to 250℃ for a long time operation and still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin.
We can produce as our standard specification and also offer special specification as customer's request.
In addition to the Silicone for encapsulation purpose, there also have many others, such as Organic Silicone Softener, Thermal Conductive Paste, Silicone Antifoam...etc.
Uncured properties :
．RAY-8626A
．viscosity : 2500 cps
．special gravity : 0.98 ± 0.02
．appearance : transparency
．RAY-8626B
．viscosity : 3000 cps
．special gravity : 0.98 ± 0.02
．appearance : transparency
Properties after cured :
．Volume resistivity: > 1.0 x 1015 ohm-cm
．Dielectric strength: > 20 Kv/mm
．Color: colorless
．refraction: 1.407
．Transmittance (1mm): 95% /(200nm-800nm)
．Shore: 18 (ShoreA)
．Operation process:
．weight: Take RAY-8626A and RAY-8626B by 10:1(weight ratio).
．Defoaming: place the mixture in vacuum vessel，kept vacuum lower than 500 mg Hg.
．Filler: Be careful pouring silicone to the container, avoid occur bubble
．Harden: Preheating(60℃X 15 min then 80℃X 30 min). then Curing 150℃X 40 min.
【Note】
Before ordering please contact us.
