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HomeProductsElectronic and optical partsSilicone for adhesive/encapsulation/seal use

Silicone for adhesive/encapsulation/seal use

TR-8011

TR-8011 was one component silicone, After curing it exhibit high thermal conductive property, exclusively apply in LED,IC chips, CPU & VLSI to transfer the internal heat to outside region. It is also widely used for encapsulation field use due it suitable for temperature up to 250oC for a long term operation. The main feature was list as follow 1.Excellent electrical properties 2.High thermal conductivity 3.High temperature working condition 4.Flame retardant (UL 94V0 grade) 5.Chemical stability 6.Easy performance 7.Pass new environmental standard Specification : Color White Specific gravity 1.77 Durometer hardness(ASTM D2240) 60 (Hardness Shore A) Tensile strength(ASTM D412) 2.0 N/mm2 Elongation(ASTM D412) 40﹪ Tear strength(ASTM D624) >1.0 N/mm Thermal conductivity > 0.85 w/m-K Volume resistivity > 5.0 x 1014 ohm-cm Dielectric constant(60Hz) 3.8 Dielectric strength 25KV/mm Adhesion strength 1.5 N/mm2 Shrinkage <0.4﹪ Skin-over time 15~25 min. Package 25 KG/Pail、500g/ cartridge.

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