Silicone resin for LED ,IC Encapsulating use Our silicone series for encapsulation field exclusively apply in LED, IC chips, CPU & VLSI to transfer the internal heat to outside region, stain higher temperature, moisture proof,adhesive for better weather resistance . Our silicone series is suitable for temperature (-50) to 250oC for a long time operation amd still keep their characters. It is the best material for Encapsulation purpose specially compare to the epoxy resin. The most popular silicone resin RAY-8677 for LED specificationand and introduction as under. Silicone resin RAY-8677 Introductions : Due to the energy saver, best brightness and higher powder LEDs was applied on very field,as general illumination backlight for LCD, and Automotive light. Old plastic lens can not stand heat cycle on LEDs applications，A new product Silicone resin ,which had heat and weather resistant ,could be apply on optical used.
Uncured properties :
RAY8677-A
viscosity : 5000 cps
special gravity: 1.01
appearance: transparency
RAY8677-B
viscosity : 1500 cps
special gravity : 1.01
appearance : transparency
Properties after cured :
Volume resistivity : > 1.0 x 1015 ohm-cm
Dielectric strength : > 20 Kv/mm
Dielectric constant(60Hz) : 3.8
Color : colorless
refraction : 1.522
Transmittance% : 92% /450nm
Shore : 70 (ShoreD)
Lost on heat : < 0.1%
Tension strength : 20. kg/cm2
Shrinkage : 0.1%
Thermal coefficint : 0.32 w/m-K
Operation process :
weight : Take RAY8677- A and RAY8677- B by the ratio of 10 : 1 (weight ratio).
Defoaming : place the mixture in vacuum vessel，kept vacuum lower than 100 mg Hg.
Filler : Be careful pouring silicone to the container, avoid Occur bubble
Harden : Heating 150℃X 30 min. then finish.
